Journal article

Wang H, Zhang G, Ma H, Zhang X, Manzanera TP, Braden D, Harvey D, Salleh MAAM. 2023. Reliability and Failure Modelling of Microelectronic Packages Based on Ultrasonic Nondestructive Evaluation Data Independent Nondestructive Testing and Evaluation (NDT and E) International, DOI Publisher Url Public Url

Baishya K, Harvey DM, Partida Manzanera T, Zhang G, Braden DR. 2022. Failure patterns of solder joints identified through lifetime vibration tests Nondestructive Testing and Evaluation, :1-25 DOI Publisher Url Public Url

Mohamad Zaimi NS, Mohd Salleh MAA, Abdullah MMAB, Ahmad R, Mostapha M, Yoriya S, Chaiprapa J, Zhang G, Harvey DM. 2020. Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint Materials Today Communications, 25 DOI Author Url Publisher Url Public Url

Baishya K, Harvey DM, Zhang G, Braden DR. 2020. Investigation into how the floor plan layout of a manufactured PCB influences flip-chip susceptibility to vibration IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 :741-748 DOI Author Url Publisher Url Public Url

Qi A, Zhang G, Dong M, Ma H-W, Harvey D. 2018. An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation Ultrasonics, 88 DOI Author Url Publisher Url Public Url

Zhang G, Lee C, Harvey D, Qi A. 2016. Characterization of Micro-Crack Propagation through Analysis of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages NDT & E International, 79 :1-6 DOI Author Url Publisher Url Public Url

Zhang G, Lee C, Harvey DM, Ma HW, Braden D. 2016. Finite Element Modelling for the Investigation of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages Measurement Science and Technology, 27 DOI Author Url Publisher Url Public Url

Zhang G, Lee C, Harvey D, Ma H. 2015. Development of C-Line plot technique for characterization of edge effects in acoustic imaging: A case study using flip chip package geometry Microelectronics Reliability, DOI Author Url Publisher Url Public Url

Harvey DM, Yang RSH, Braden DR, Zhang GM. 2014. Effects of component placement on solder joint through-life reliability Proceedings of the Institution of Mechanical Engineers, Part O: Journal of Risk and Reliability, DOI Author Url Publisher Url

Braden DR, Harvey DM. 2014. A prognostic and data fusion based approach to validating automotive electronics SAE Technical Papers, 1 DOI Publisher Url

Lee C, Zhang GM, Harvey D. 2014. An implementation of rectangular infinite absorbing boundaries for acoustic simulation NDT 2014 - 53rd Annual Conference of the British Institute of Non-Destructive Testing,

Harvey D. 2014. Report of the Editor-in-Chief Journal of Agricultural Economics, 65 :518-526 DOI Publisher Url

Zhang GM, Zhang CZ, Harvey DM. 2012. Sparse signal representation and its applications in ultrasonic NDE Ultrasonics, 52 :351-363 DOI Author Url Publisher Url

Yang RSH, Braden DR, Zhang G-M, Harvey DM. 2012. Through lifetime monitoring of solder joints using acoustic micro imaging Soldering and Surface Mount Technology, 24 :30-37 DOI Author Url Publisher Url

Zhang G-M, Harvey DM. 2012. Contemporary ultrasonic signal processing approaches for nondestructive evaluation of multilayered structures Nondestructive Testing and Evaluation, 27 :1-27 DOI Author Url Publisher Url

Yang RSH, Braden DR, Zhang G-M, Harvey DM. 2012. An automated ultrasonic inspection approach for flip chip solder joint assessment Microelectronics Reliability, DOI Author Url

Papadopoulou E, Hasanagas N, Harvey D. 2011. Analysis of rural development policy networks in Greece: Is LEADER really different? Land Use Policy, 28 :663-673 DOI Publisher Url

Zhang G-M, Harvey DM, Burton DR. 2011. Micro-nondestructive evaluation of microelectronics using three-dimensional acoustic imaging APPLIED PHYSICS LETTERS, 98 DOI Author Url Publisher Url

Zhang G-M, Zhang C-Z, Harvey DM. 2011. Sparse signal representation and its applications in ultrasonic NDE Ultrasonics,

Zhang G-M, Braden DR, Harvey DM, Burton DR. 2010. Acoustic time-frequency domain imaging. J Acoust Soc Am, 128 :EL323-EL328 DOI Author Url Publisher Url

De Carvalho CV, Harvey D, Hobson A, Yu S. 2008. Transferring e-learning skills between europe and China: The Telepath approach Proceedings of the 10th IASTED International Conference on Computers and Advanced Technology in Education, :243-247

Zhang G-M, Harvey DM, Braden DR. 2008. Signal denoising and ultrasonic flaw detection via overcomplete and sparse representations JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 124 :2963-2972 DOI Author Url Publisher Url

Harvey D. 2008. A conjecture on the nature of social systems Twenty-First Century Society, 3 :87-108 DOI Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2007. Microelectronic package characterisation using scanning acoustic microscopy NDT & E INTERNATIONAL, 40 :609-617 DOI Author Url Publisher Url

Harvey DM, Zhang GM, Braden DR. 2007. Sensing requirements for modern circuit board inspection Journal of Physics: Conference Series, 76 DOI Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2006. Effect of sparse basis selection on ultrasonic signal representation ULTRASONICS, 45 :82-91 DOI Author Url Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2006. Adaptive sparse representations of ultrasonic signals for acoustic microimaging JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 120 :862-869 DOI Author Url Publisher Url

Grudin MA, Lisboa PJG, Harvey DM. 2006. Selection of localised salient features from a single facial image IEE PROCEEDINGS-VISION IMAGE AND SIGNAL PROCESSING, 153 :461-467 DOI Author Url Publisher Url

Harvey DM, Grudin, MA, Lisboa PJG. 2006. Selection of localised salient features from a single facial image IEE Proceedings Vision Image Signal Processing, 153 :461-467 DOI

Zhang GM, Harvey DM, Braden DR. 2006. Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages IEEE TRANSACTIONS ON ADVANCED PACKAGING, 29 :271-283 DOI Author Url Publisher Url

Zhang GM, Harvey DM, Braden DR. 2006. Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection MICROELECTRONICS RELIABILITY, 46 :811-821 DOI Author Url Publisher Url

Harvey D. 2006. The EU budget and the CAP: An agenda for the review? EuroChoices, 5 :22-27 DOI Publisher Url

Zhang GM, Harvey DM, Braden DR. 2005. Improved acoustic microimaging technique with learning overcomplete representation JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 118 :3706-3720 DOI Author Url Publisher Url

Zhang GM, Harvey DM, Braden DR. 2005. An improved acoustic microimaging technique with learning overcomplete representation Journal of the Acoustical Society of America, 118 :3706-3720 DOI

Zhang GM, Harvey DM, Braden DR. 2005. Ultrasonic signal interpretation improvement for detection of defects in microelectronic packages Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005, :206-213

Jakobsen ML, Wilkinson P, Barton JS, Reuben RL, Harvey D, Jones JDC. 2005. The effects of progressive wear on the frequency characteristic of acoustic emission acquired during face milling Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 219 :803-810 DOI Publisher Url

Zhang GM, Harvey DM, Braden DR. 2004. High-resolution AMI technique for evaluation of microelectronic packages ELECTRONICS LETTERS, 40 :399-400 DOI Author Url

Moorehead JD, Montgomery SC, Harvey DM. 2003. Instant center of rotation estimation using the Reuleaux technique and a Lateral Extrapolation technique JOURNAL OF BIOMECHANICS, 36 :1301-1307 DOI Author Url Publisher Url

Niewczas P, Dziuda L, Fusiek G, Willshire AJ, McDonald JR, Thursby G, Harvey D, Michie WC. 2003. Interrogation of extrinsic Fabry-Pérot interferometric sensors using arrayed waveguide grating devices IEEE Transactions on Instrumentation and Measurement, 52 :1092-1096 DOI Publisher Url

Murphy CW, Harvey DM. 2002. Reconfigurable hardware implementation of BinDCT ELECTRONICS LETTERS, 38 :1012-1013 DOI Author Url Publisher Url

Niewczas P, Dziuda L, Fusiek G, Willshire AJ, McDonald JR, Thursby G, Harvey D, Michie WC. 2002. Interrogation of extrinsic Fabry-Perot interferometric sensors using arrayed waveguide grating devices Conference Record - IEEE Instrumentation and Measurement Technology Conference, 2 :1677-1681 DOI Publisher Url

Harvey DM, Kshirsagar SP, Hobson CA. 2001. Low cost scaleable parallel image processing system MICROPROCESSORS AND MICROSYSTEMS, 25 :143-157 DOI Author Url Publisher Url

Harvey DM, Arshad NM, Hobson CA. 2001. Image data compression and it's effect on the accuracy of fringe-based images for 3-D gauging using a phase stepping method OPTICS AND LASERS IN ENGINEERING, 35 :201-223 DOI Author Url Publisher Url

Moorehead JD, Harvey DM, Montgomery SC. 2001. A surface-marker imaging system to measure a moving knee's rotational axis pathway in the sagittal plane IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, 48 :384-393 DOI Author Url Publisher Url

Timchenko LI, Grudin MA, Kutayev YF, Harvey DM, Gertziy AA. 2000. Parallel-hierarchical approach to image processing Engineering Simulation, 17 :483-496

Murphy CW, Harvey DM, Nicolson LJ. 1999. Low cost TMS320C40/XC6200 based re-configurable parallel image processing architecture IEE Colloquium (Digest), :41-45

Jakobsen ML, Harvey D, Carolan TA, Barton JS, Jones JDC, Reuben RL. 1999. Optical probing of acoustic emission from a rotating tool holder with a Sagnac interferometer Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 213 :171-181 DOI Publisher Url

Timchenko LI, Chepornyuk SV, Grudin MA, Harvey DM, Kutaev YF, Gertsiy AA, Zahoruiko LV. 1997. Three-dimensional multistage network applying for facial images decomposition Proceedings of SPIE - The International Society for Optical Engineering, 3205 :90-95 DOI Publisher Url

Timchenko LI, Grudin MA, Gel VP, Harvey DM. 1996. A multistage hierarchical approach to image processing IEE Colloquium (Digest),

Harvey DM. 1996. BILCO: Built in testing method for combinational logic circuits ELECTRONICS LETTERS, 32 :31-33 DOI Author Url Publisher Url

Moorehead JD, Harvey DM. 1995. Testability aspects of DSP based image processing system IEE Colloquium (Digest),

Harvey DM, Kshirsagar SP, Hobson CA, Hartley DA, Moorehead JD. 1995. Digital signal processing systems architectures for image processing IEE Conference Publication, :460-464 DOI Publisher Url

Kshirsagar SP, Harvey DM, Hartley DA, Hobson CA. 1994. Design and application of parallel TMS320C40-based image processing system IEE Colloquium (Digest),

Kshirsagar SP, Hartley DA, Harvey DM, Hobson CA. 1994. Design and application of parallel digital signal processor based image processing system for industrial inspection IEE Colloquium (Digest),

Harvey D, McBride R, Barton JS, Jones JDC. 1992. A velocimeter based on the fibre optic Sagnac interferometer Measurement Science and Technology, 3 :1077-1083 DOI Publisher Url

Pearson JD, Dangerfield PH, Atkinson JT, Gomm JB, Dorgan JC, Hobson CA, Harvey DM. 1992. Measurement of body surface topography using an automated imaging system. Acta Orthop Belg, 58 Suppl 1 :73-79 Author Url

Harvey DM, Shaw MM, Hobson CA, Wood CM, Atkinson JT, Lalor MJ. 1991. Three-dimensional inspection using laser-based dynamic fringe projection Proceedings of SPIE - The International Society for Optical Engineering, 1400 :86-93

Harvey D. 1991. Forestry expansion - a study of technical, economic and ecological factors. The agricultural demand for land: its availability and cost for forestry Occasional Paper - Forestry Commission, 44

Wood CM, Shaw MM, Harvey DM, Hobson CA, Lalor MJ, Atkinson JT. 1990. Absolute range measurement system for real-time, 3-D vision Proceedings of SPIE - The International Society for Optical Engineering, 1332 :301-313

Shaw MM, Harvey DM, Hobson CA, Lalor MJ. 1989. Non-contact ranging using dynamic fringe projection Proceedings of SPIE - The International Society for Optical Engineering, 1163 :22-29 DOI Publisher Url

Millar CA, Harvey D, Urquhart P. 1989. Fibre reflection mach-zehnder interferometer Optics Communications, 70 :304-308 DOI Publisher Url

Blandford D, de Gorter H, Harvey D. 1989. Farm income support with minimal trade distortions Food Policy, 14 :268-273 DOI Publisher Url

Harvey D. 1989. Alternatives to present price policies for the CAP European Review of Agricultural Economics, 16 :83-111 DOI Publisher Url

Shaw MM, Atkinson JT, Harvey DM, Hobson CA, Lalor MJ. 1988. Range measurement using dynamic fringe protection JOURNAL OF PHYSICS D-APPLIED PHYSICS, 21 :S4-S7 DOI Author Url Publisher Url

Harvey DM, Hobson CA, Lalor MJ, Koukash M. 1987. Real-time intelligent hardware-based image processing Proceedings of SPIE - The International Society for Optical Engineering, 657 :109-115 DOI Publisher Url

Zhang G, Deng W, Murphy MF, Lilley F, Harvey D, Burton DR. Analysis of Dynamic Cantilever Behaviour in Tapping Mode Atomic Force Microscopy Microscopy Research and Technique, 78 :935-946 DOI Author Url Publisher Url Public Url

Conference publication

Harvey DM, Manzanera TP, Baishya K, Zhang G, Arif MAAMS, Chan YC, Ekere N, Braden D. 2023. Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder 24th European Microelectronics and Packaging Conference, EMPC 2023, DOI Publisher Url

Harvey DM, Zhang G, Ekere N, Manzanera TP, Mohd Salleh Arif MAA, Braden D, Baishya K, Chan YC. 2023. Practical study to demonstrate an increase in the reliability of flip chip connections by adding nanoparticles to solder Advancing Microelectronics, 2023 :119-122 DOI Publisher Url

Mokhtar NZM, Salleh MAAM, Zhang GM, Harvey DM, Nabialek M, Hashim AN, Nazri SF. 2020. Tin whiskers formation in Sn0.7Cu0.05Ni1.5Bi under electro-Migration stressing Acta Physica Polonica A, 138 :261-264 DOI Publisher Url

Olumide AA, Baishya K, Zhang G-M, Braden DR, Harvey DM. 2018. Non-destructive Evaluation and Life Monitoring of Solder Joints in Area Array Packaging 2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 7th Electronic System-Integration Technology Conference (ESTC) DOI Author Url Publisher Url

Harvey DM, Zhang GM, Braden DR, Baishya K. 2016. Real World Modelling of Circuit Board Assemblies to help inform prognostic predictions IEEE ESTC 2016 DOI Author Url Publisher Url

Harvey DM, Braden DR. 2014. Aligning Component and System Qualification Testing Through Prognostics Paulasto-Kröckel M. Electronics System-Integration Technology Conference ESTC2014 DOI Publisher Url

Yang RSH, Harvey DM, Zhang G-M, Braden DR. 2012. Fusion of Acoustic and X-ray Image Features for Solder Joint Through-life Monitoring during Thermal Cycling Tests 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 4th Electronic System-Integration Technology Conference (ESTC) DOI Author Url Publisher Url

Lee C, Zhang G-M, Harvey D. 2012. Analysis of Solder Joint Edge Effect in Acoustic Micro Imaging of Microelectronic Packages: A Preliminary Study 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 4th Electronic System-Integration Technology Conference (ESTC) DOI Author Url Publisher Url

Braden DR, Yang RSH, Duralek J, Zhang G, Harvey DM. 2012. Component layout influences on solder joint reliability studied using through life inspection techniques Electronic System-Integration Technology Conference (ESTC), 2012 4th, Electronic System-Integration Technology Conference (ESTC), 2012 4th :1-6 DOI Author Url Publisher Url

Yang RSH, Harvey DM, Zhang GM, Braden DR. 2010. Reliability of solder joints assessed by acoustic imaging during accelerated thermal cycling Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, DOI Publisher Url

Braden DR, Yang RSH, Duralek J, Zhang GM, Harvey DM. 2010. Investigation into the impact of component floor plan layout on the overall reliability of electronics systems in harsh environments Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, DOI Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2008. Sparse deconvolution of ultrasonic NDE traces - a preliminary study 2008 IEEE ULTRASONICS SYMPOSIUM, VOLS 1-4 AND APPENDIX, IEEE Ultrasonics Symposium :176-+ DOI Author Url Publisher Url

Zhang G, Harvey DM, Bradeno DR. 2008. Ultrasonic Flaw Detection Using Sparse Representation for Failure Analysis of Next Generation Microelectronic Packages ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2nd Electronics System-Integration Technology Conference :1045-+ DOI Author Url Publisher Url

Kadim HJ, Harvey DM. 2000. Robust parameter identification for virtual test of systems on a chip IEE Colloquium (Digest), :13-18

Kadim HJ, Harvey DM. 2000. Estimation of parameter fluctuations for robust operation in analogue circuits and systems ISCAS 2000: IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS - PROCEEDINGS, VOL II, IEEE International Symposium on Circuits and Systems (ISCAS 2000) :741-744 DOI Author Url Publisher Url

Arshad NM, Harvey DM, Hobson CA. 1998. Investigation of data compression for digital video cameras in on-line machine vision systems Batchelor BG. MACHINE VISION SYSTEMS FOR INSPECTION AND METROLOGY VII, Conference on Machine Vision Systems for Inspection and Metrology VII 3521 :325-333 DOI Author Url Publisher Url

Murphy CW, Harvey DM, Nicolson LJ. 1998. A low cost re-configurable DSP-based parallel image processing computer Schewel J. CONFIGURABLE COMPUTING: TECHNOLOGY AND APPLICATIONS, Conference on Configurable Computing - Technology and Applications 3526 :14-24 DOI Author Url Publisher Url

Grudin MA, Lisboa PJG, Harvey DM. 1997. A neural-network approach for compact multi-level representation of human faces FIFTH INTERNATIONAL CONFERENCE ON ARTIFICIAL NEURAL NETWORKS, 5th International Conference on Artificial Neural Networks :42-47 Author Url

Grudin MA, Lisboa PJG, Harvey DM. 1997. Compact multi-level representation of human faces for identification SIXTH INTERNATIONAL CONFERENCE ON IMAGE PROCESSING AND ITS APPLICATIONS, VOL 1, 6th International Conference on Image Processing and its Applications :111-115 DOI Author Url Publisher Url

Grudin MA, Harvey DM, Timchenko LI, Lisboa PGJ. 1997. Fast face recognition method using a multistage hierarchical network 1997 IEEE INTERNATIONAL CONFERENCE ON ACOUSTICS, SPEECH, AND SIGNAL PROCESSING, VOLS I - V, 1997 IEEE International Conference on Acoustics, Speech, and Signal Processing (ICASSP 97) :2545-2548 Author Url

Timchenko LI, Kutaev YF, Grudin MA, Chepornyuk SV, Harvey DM, Gertsiy AA. 1997. A brain-like approach to multistage hierarchical image processing Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics), 1311 :246-253 DOI Publisher Url

Grudin MA, Harvey DM, Timchenko LI. 1996. Multistage hierarchy for fast image analysis Desachy J. IMAGE AND SIGNAL PROCESSING FOR REMOTE SENSING III, 3rd Conference on Image and Signal Processing for Remote Sensing 2955 :120-128 DOI Author Url Publisher Url

Arshad NM, Harvey DM, Hobson CA. 1996. Digital monochrome CCD camera for robust pixel correspondant, data compression and pre-processing in an integrated PC based image processing environment Bernard TM. ADVANCED FOCAL PLANE ARRAYS AND ELECTRONIC CAMERAS, Conference on Advanced Focal Plane Arrays and Electronic Cameras (AFPAEC 96) 2950 :168-173 DOI Author Url Publisher Url

Grudin MA, Timchenko LI, Harvey DM, Gel VP. 1996. System-theoretical approach to multistage image processing Refregier P. VISION SYSTEMS: NEW IMAGE PROCESSING TECHNIQUES, Conference on Vision Systems - New Image Processing Techniques 2785 :224-234 DOI Author Url Publisher Url

Timchenko LI, Grudin MA, Gel VP, Harvey DM. 1996. Multistage hierarchical approach to image processing IEE Colloquium (Digest),

KSHIRSAGAR SP, HARTLEY DA, HARVEY DM, HOBSON CA. 1994. PARALLEL DIGITAL SIGNAL PROCESSING ARCHITECTURES FOR IMAGE PROCESSING Luk FT. ADVANCE SIGNAL PROCESSING: ALGORITHMS, ARCHITECTURES, AND IMPLEMENTATIONS V, 5th SPIE Conference on Advanced Signal Processing - Algorithms, Architectures, and Implementations 2296 :660-670 DOI Author Url Publisher Url

MOOREHEAD J, HARVEY D, DANGERFIELD P, MONTGOMERY S. 1994. REAL-TIME MEASUREMENT OF JOINT MOVEMENT USING A DIGITAL SIGNAL PROCESSOR-BASED IMAGE-PROCESSING SYSTEM Tescher AG. APPLICATIONS OF DIGITAL IMAGE PROCESSING XVII, Conference on Applications of Digital Image Processing XVII 2298 :644-651 DOI Author Url Publisher Url

SHAW M, ATKINSON J, HARVEY D, HOBSON A, LALOR M. 1994. 3-D IMAGING USING PROJECTED DYNAMIC FRINGES Kujawinska M, Patorski K. NEW TECHNIQUES AND ANALYSIS IN OPTICAL MEASUREMENTS - INTERFEROMETRY '94, Interferometry 94 - New Techniques and Analysis in Optical Measurements Conference 2340 :134-143 DOI Author Url Publisher Url

Hartley DA, Harvey DM. 1993. Enhanced inter-processor communication strategies for parallel TMS320C40 digital signal processor systems Proceedings of SPIE - The International Society for Optical Engineering, 2027 :495-507 DOI Publisher Url

Kshirsagar SP, Hobson CA, Hartley DA, Harvey DM. 1993. Image processing system architecture using parallel arrays of digital signal processors Proceedings of SPIE - The International Society for Optical Engineering, 2028 :280-289 DOI Publisher Url

Hartley DA, Harvey DM. 1993. Analysis of the TMS320C40 communication channels using timed petri nets Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics), 691 LNCS :562-571 DOI Publisher Url

Valera JD, Harvey D, Jones JD. 1991. Automatic heterodyning of fiber-optic speckle pattern interferometry Proceedings of SPIE - The International Society for Optical Engineering, 1508 :170-179

Valera JD, Harvey D, Jones JDC. 1991. Fiber optic electronic speckle pattern interferometry. Path length stabilised automatic phase stepping IEE Conference Publication, :180-184

Harvey DM, Hobson CA, Lalor MJ. 1983. PRODUCT INSPECTION USING REAL TIME ANALYSIS OF OPTICAL INTERFERENCE AND DIFFRACTION PATTERNS. :419-426

Harvey DM, Hobson CA, Lalor MJ. 1982. OPTICAL INSPECTION OF SMALL COMPONENTS. Proceedings of the International Conference on Automated Inspection and Product Control, :153-160

Harvey DM, Zhang GM, Baishya K, Braden DR. Toolbox for 3D Imaging of Manufactured Electronic Circuits IEEE ESTC 2016 DOI Author Url Publisher Url Public Url