Liverpool Skyline

General Engineering Research Institute

Dr Guangming Zhang

Dr Guangming Zhang

Telephone: 0151 231 2018

Publications

Highlighted publications

Qi A, Zhang G, Dong M, Ma H-W, Harvey D. 2018. An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation Ultrasonics, 88 :1-8 >DOI

Lee CS, Zhang G-M, Harvey DM, Ma H-W. 2015. Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry Microelectronics Reliability, 55 :2762-2768 >DOI

Zhang G, Wang X, Ma H-W, Zhang Y, Wang D. Measurement of 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation Sensors,

Zhang G, Lee C, Harvey DM, Ma HW, Braden D. Finite Element Modelling for the Investigation of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages Measurement Science and Technology, >DOI

Journal article

Qi A, Zhang G, Dong M, Ma H-W, Harvey D. 2018. An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation Ultrasonics, 88 :1-8 >DOI

Dong M, Ma H, Zhang G, Chen Y, Zhang X, Cao X. 2017. A model for determining electromechanical response profile of ultrasonic transducers and ultrasonic transient echo Shengxue Xuebao/Acta Acustica, 42 :403-410

Lee CS, Zhang G-M, Harvey DM, Qi A. 2016. Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages NDT & E International, 79 :1-6 >DOI

Dong M, Ma H, Chen Y, Yang P, Zhang G. 2015. A high-speed method for computing the exact solution of spatial impulse response Shengxue Xuebao/Acta Acustica, 40 :850-854

Lee CS, Zhang G-M, Harvey DM, Ma H-W. 2015. Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry Microelectronics Reliability, 55 :2762-2768 >DOI

Deng W, Zhang G-M, Murphy MF, Lilley F, Harvey DM, Burton DR. 2015. Analysis of Dynamic Cantilever Behavior in Tapping Mode Atomic Force Microscopy MICROSCOPY RESEARCH AND TECHNIQUE, 78 :935-946 >DOI

Lee C, Zhang GM, Harvey D. 2014. An implementation of rectangular infinite absorbing boundaries for acoustic simulation NDT 2014 - 53rd Annual Conference of the British Institute of Non-Destructive Testing,

Zhang C, Zhang G, Ye B, Liang L. 2014. Three Dimensional Motion Tracking of a Point on a Bowed Violin String Using High Speed Videography Acta Acustica united with Acustica, 100 :574-582 >DOI

Chen Y, Ma HW, Zhang GM. 2014. A support vector machine approach for classification of welding defects from ultrasonic signals Nondestructive Testing and Evaluation, 29 :243-254 >DOI

Harvey DM, Yang RSH, Braden DR, Zhang GM. 2014. Effects of component placement on solder joint through-life reliability Proceedings of the Institution of Mechanical Engineers, Part O: Journal of Risk and Reliability, >DOI

Chen Y, Ma H-W, Zhang G-M. 2014. A support vector machine approach for classification of welding defects from ultrasonic signals NONDESTRUCTIVE TESTING AND EVALUATION, 29 :243-254 >DOI >Link

Zhang C, Ye B, Liang L, Jia X, Zhang G. 2014. Experimental and numerical studies of violin bridge vibration mechanism Key Engineering Materials, 579-580 :536-541 >DOI

Zhang C-Z, Zhang G-M, Ye B-Y, Liang L-D. 2013. Violin Bridge Mobility Analysis under In-Plane Excitation Sensors, 13 :15290-15306 >DOI

Zhang G-M, Harvey DM. 2012. Contemporary ultrasonic signal processing approaches for nondestructive evaluation of multilayered structures Nondestructive Testing and Evaluation, 27 :1-27

Yang RSH, Braden DR, Zhang G-M, Harvey DM. 2012. Through lifetime monitoring of solder joints using acoustic micro imaging Soldering and Surface Mount Technology, 24 :30-37

Zhang GM, Zhang CZ, Harvey DM. 2012. Sparse signal representation and its applications in ultrasonic NDE Ultrasonics, 52 :351-363 >DOI

Yang RSH, Braden DR, Zhang GM, Harvey DM. 2012. An automated ultrasonic inspection approach for flip chip solder joint assessment Microelectronics Reliability, 52 :2995-3001 >DOI

Zhang G-M, Harvey DM, Burton DR. 2011. Micro-nondestructive evaluation of microelectronics using three-dimensional acoustic imaging APPLIED PHYSICS LETTERS, 98 >DOI >Link

Zhang G-M, Braden DR, Harvey DM, Burton DR. 2010. Acoustic time-frequency domain imaging. J Acoust Soc Am, 128 :EL323-EL328 >DOI >Link

Zhang G-M, Harvey DM, Braden DR. 2008. Signal denoising and ultrasonic flaw detection via overcomplete and sparse representations JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 124 :2963-2972 >DOI >Link

Harvey DM, Zhang GM, Braden DR. 2007. Sensing requirements for modern circuit board inspection Journal of Physics: Conference Series, 76 >DOI

Zhang G-M, Harvey DM, Braden DR. 2007. Microelectronic package characterisation using scanning acoustic microscopy NDT & E INTERNATIONAL, 40 :609-617 >DOI >Link

Zhang GM, Harvey DM, Braden DR. 2006. Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages IEEE TRANSACTIONS ON ADVANCED PACKAGING, 29 :271-283 >DOI

Zhang GM, Harvey DM, Braden DR. 2006. Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection MICROELECTRONICS RELIABILITY, 46 :811-821 >DOI >Link

Zhang G-M, Harvey DM, Braden DR. 2006. Adaptive sparse representations of ultrasonic signals for acoustic microimaging JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 120 :862-869 >DOI

Zhang G-M, Harvey DM, Braden DR. 2006. Effect of sparse basis selection on ultrasonic signal representation ULTRASONICS, 45 :82-91 >DOI >Link

Zhang GM, Harvey DM, Braden DR. 2005. Ultrasonic signal interpretation improvement for detection of defects in microelectronic packages Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005, :206-213

Zhang GM, Harvey DM, Braden DR. 2005. Improved acoustic microimaging technique with learning overcomplete representation JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 118 :3706-3720 >DOI >Link

Zhang GM, Harvey DM, Braden DR. 2005. An improved acoustic microimaging technique with learning overcomplete representation Journal of the Acoustical Society of America, 118 :3706-3720 >DOI

Zhang GM, Olofsson T, Stepinski T. 2004. Ultrasonic NDE image compression by transform and subband coding NDT and E International, 37 :325-333 >DOI

Zhang GM, Harvey DM, Braden DR. 2004. High-resolution AMI technique for evaluation of microelectronic packages ELECTRONICS LETTERS, 40 :399-400 >DOI >Link

Cheng L-P, Zhang G-M, Zhang S-Y, Zhang Z-N, Shui X-J. 2003. Theoretical simulation of a rotary motor driven by surface acoustic waves Acoustical Physics, 49 :158-162 >DOI >Link

Cheng L, Zhang G, Zhang S, Yu J, Shui X. 2003. Study on surface acoustic wave rotary motor Shengxue Xuebao/Acta Acustica, 28 :123-126

Cheng LP, Zhang GM, Zhang SY, Yu J, Shui XJ. 2002. Miniaturization of surface acoustic waves rotary motor Ultrasonics, 39 :591-594 >DOI

Zhang GM, Hou CG, Wang YW, Zhang SY. 2001. Optimal frequency-to-bandwidth ratio of wavelet in ultrasonic non-destructive evaluation Ultrasonics, 39 :13-17 >DOI

Zhang G-M, Cheng L-P, Zhang S-Y, Yu J, Shui X-J. 2000. Surface acoustic wave rotation motor Electronics Letters, 36 :1437 -1438-1437 -1438 >DOI

Zhang G, Zhao M, Wang Y, Tan Y. 2000. Wavelet transform signal processing: determination of the processing parameters in ultrasonic flaw detection Shengxue Xuebao/Acta Acustica, 25 :450-454

Zhang G, Zhang S, Wang Y. 2000. Application of adaptive time-frequency decomposition in ultrasonic NDE of highly-scattering materials. Ultrasonics, 38 :961-964 >Link

Ma H, Zhang G, Wang T, Mei L, Wang Y, Xue J. 1998. Ultrasonic nondestructive testing of braze defects Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University, 32 :80-84

Hou C, Zhao M, Zhang G, Wang Y. 1997. Multiple-function infrared-image processing system Jiguang Yu Hongwai/Laser and Infrared, 27 :39-41

Hou C, Zhang G, Zhao M, Qu L. 1997. Accurate measurement of object emissivity using infrared imaging technique Hongwai Yu Haomibo Xuebao/Journal of Infrared and Millimeter Waves, 16 :193-198

Zhou J, Luo D, Zhang G, Tan Y. 1997. Research on a new type optical probe Guangdianzi Jiguang/Journal of Optoelectronics Laser, 8 :344-349

Zhang G, Wang X, Ma H-W, Zhang Y, Wang D. Measurement of 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation Sensors,

Zhang G, Deng W, Murphy M, Lilley F, Harvey D, Burton D. Analysis of Dynamic Cantilever Behaviour in Tapping Mode Atomic Force Microscopy Microscopy Research and Technique, >DOI

Zhang G, Lee C, Harvey DM, Ma HW, Braden D. Finite Element Modelling for the Investigation of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages Measurement Science and Technology, >DOI

Conference publication

Qi A, Fu J, Zhang G. 2017. Application of Basis Pursuit in Signal Denoising of Ultrasonic Testing Flaw Li JB. PROCEEDINGS FIRST INTERNATIONAL CONFERENCE ON ELECTRONICS INSTRUMENTATION & INFORMATION SYSTEMS (EIIS 2017), 1st International Conference on Electronics Instrumentation & Information Systems (EIIS) :57-61

Harvey DM, Zhang GM, Braden DR, Baishya K. 2016. Real World Modelling of Circuit Board Assemblies to help inform prognostic predictions IEEE ESTC 2016 >DOI

Harvey DM, Zhang GM, Baishya K, Braden DR. 2016. Toolbox for 3D Imaging of Manufactured Electronic Circuits IEEE ESTC 2016 >DOI

Braden DR, Yang RSH, Duralek J, Zhang G, Harvey DM. 2012. Component layout influences on solder joint reliability studied using through life inspection techniques Electronic System-Integration Technology Conference (ESTC), 2012 4th, Electronic System-Integration Technology Conference (ESTC), 2012 4th :1-6

Lee C, Zhang G-M, Harvey D. 2012. Analysis of Solder Joint Edge Effect in Acoustic Micro Imaging of Microelectronic Packages: A Preliminary Study 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 4th Electronic System-Integration Technology Conference (ESTC) >Link

Yang RSH, Harvey DM, Zhang G-M, Braden DR. 2012. Fusion of Acoustic and X-ray Image Features for Solder Joint Through-life Monitoring during Thermal Cycling Tests 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 4th Electronic System-Integration Technology Conference (ESTC) >Link

Braden DR, Yang RSH, Duralek J, Zhang GM, Harvey DM. 2010. Investigation into the impact of component floor plan layout on the overall reliability of electronics systems in harsh environments Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, >DOI

Yang RSH, Harvey DM, Zhang GM, Braden DR. 2010. Reliability of solder joints assessed by acoustic imaging during accelerated thermal cycling Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, >DOI

Zhang G-M, Harvey DM, Braden DR. 2008. Sparse deconvolution of ultrasonic NDE traces - a preliminary study 2008 IEEE ULTRASONICS SYMPOSIUM, VOLS 1-4 AND APPENDIX, IEEE Ultrasonics Symposium :176-+ >DOI >Link

Zhang G, Harvey DM, Bradeno DR. 2008. Ultrasonic Flaw Detection Using Sparse Representation for Failure Analysis of Next Generation Microelectronic Packages ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2nd Electronics System-Integration Technology Conference :1045-+ >DOI >Link

Chapters

Zhang G, Wang Y, Zhang S, Zhang B. 2002. Ultrasonic NDE Using Instantaneous Phase Information Via Morlet Wavelet Transform Halliwell M, Wells PT. Acoustical Imaging :197-202 Springer US 978-0-306-46516-1 >DOI >Link

Engagement & Impact

Membership of professional bodies:

Fellow, the Higher Education Academy