Journal article

Di Cairano M, Caruso MC, Galgano F, Favati F, Ekere N, Tchuenbou-Magaia F. 2021. Effect of sucrose replacement and resistant starch addition on textural properties of gluten-free doughs and biscuits European Food Research and Technology, 247 :707-718 DOI

Eslami Majd A, Ekere NN. 2020. Crack initiation and growth in PV module interconnection Solar Energy, 206 :499-507 DOI

Jeong IH, Majd AE, Jung JP, Ekere NN. 2020. Electrical and mechanical analysis of different TSV geometries Metals, 10 DOI

Eslami Mjad A, Ekere NN. 2019. Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules Solar Energy, 194 :649-655 DOI

Ogbomo OO, Amalu EH, Ekere NN, Olagbegi PO. 2018. Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates Solar Energy, 170 :682-693 DOI

Zarmai MT, Ekere NN, Oduoza CF, Amalu EH. 2017. Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections Robotics and Computer-Integrated Manufacturing, 47 :37-43 DOI

Ogbomo OO, Amalu EH, Ekere NN, Olagbegi PO. 2017. A review of photovoltaic module technologies for increased performance in tropical climate Renewable and Sustainable Energy Reviews, 75 :1225-1238 DOI

Ogbomo OO, Amalu EH, Ekere NN, Olagbegi PO. 2017. Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules Operating in Elevated Temperature Climate on the Joint's Damage Procedia Manufacturing, 11 :1145-1152 DOI

Amalu EH, Ekere NN. 2016. Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies Journal of Manufacturing Systems, 39 :9-23 DOI

Zarmai MT, Ekere NN, Oduoza CF, Amalu EH. 2016. Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly Microelectronics Reliability, 59 :117-125 DOI

Zarmai MT, Ekere NN, Oduoza CF, Amalu EH. 2015. A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly Applied Energy, 154 :173-182 DOI

Amalu EH, Ekere NN, Zarmai MT, Takyi G. 2015. Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method Finite Elements in Analysis and Design, 107 :13-27 DOI

Kumar S, Mallik S, Ekere N, Jung J. 2013. Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps Metals and Materials International, 19 :1083-1090 DOI

Mallik S, Chan EHL, Ekere N. 2013. Nonlinear viscoelastic characteristics of Sn-Ag-Cu solder pastes used in electronics assembly applications Journal of Materials Engineering and Performance, 22 :1186-1193 DOI

Otiaba KC, Bhatti RS, Ekere NN, Mallik S, Ekpu M. 2013. Finite element analysis of the effect of silver content for Sn-Ag-Cu alloy compositions on thermal cycling reliability of solder die attach Engineering Failure Analysis, 28 :192-207 DOI

Amalu EH, Ekere NN. 2012. Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling Computational Materials Science, 65 :470-484 DOI

Amalu EH, Ekere NN. 2012. High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height Microelectronics Reliability, 52 :2982-2994 DOI

Amalu EH, Ekere NN. 2012. Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations Microelectronics Reliability, 52 :2731-2743 DOI

Otiaba KC, Bhatti RS, Ekere NN, Mallik S, Alam MO, Amalu EH, Ekpu M. 2012. Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device Microelectronics Reliability, 52 :1409-1419 DOI

Amalu EH, Ekere NN. 2012. High temperature reliability of lead-free solder joints in a flip chip assembly Journal of Materials Processing Technology, 212 :471-483 DOI

Amalu EH, Ekere NN, Bhatti RS, Mallik S, Takyi G, Ibhadode AOA. 2012. Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion Advanced Materials Research, 367 :287-292 DOI

Otiaba KC, Ekere NN, Amalu EH, Bhatti RS, Mallik S. 2012. Thermal management materials for electronic control unit: Trends, processing technology and R&D challenges Advanced Materials Research, 367 :301-307 DOI

Otiaba KC, Ekere NN, Bhatti RS, Mallik S, Alam MO, Amalu EH. 2011. Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges Microelectronics Reliability, 51 :2031-2043 DOI

Amalu EH, Lau WK, Ekere NN, Bhatti RS, Mallik S, Otiaba KC, Takyi G. 2011. A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits Microelectronic Engineering, 88 :1610-1617 DOI

Amalu EH, Ekere NN, Mallik S. 2011. Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process Materials and Design, 32 :3189-3197 DOI

Marks AE, Ekere NN, Mallik S, Bhatti R. 2011. Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes Soldering and Surface Mount Technology, 23 :75-84 DOI

Mallik S, Ekere N, Best C, Bhatti R. 2011. Investigation of thermal management materials for automotive electronic control units Applied Thermal Engineering, 31 :355-362 DOI

Mallik S, Ekere NN, Bhatti R. 2011. Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications ASTM Special Technical Publication, 1530 :168-185 DOI

Mallik S, Schmidt M, Bauer R, Ekere NN. 2010. Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance Soldering and Surface Mount Technology, 22 :42-49 DOI

Mallik S, Ekere NN, Bhatti R. 2010. Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications Journal of ASTM International, 7 DOI

Takyi G, Ekere NN. 2010. Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBs Soldering and Surface Mount Technology, 22 :17-21 DOI

Durairaj R, Man LW, Ekere NN, Mallik S. 2010. The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes Materials and Design, 31 :1056-1062 DOI

Mallik S, Ekere NN, Marks AE, Seman A, Durairaj R. 2010. Modeling the structural breakdown of solder paste using the structural kinetic model Journal of Materials Engineering and Performance, 19 :40-45 DOI

Takyi G, Ekere NN. 2010. Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering Soldering and Surface Mount Technology, 22 :37-42 DOI

Durairaj R, Mallik S, Seman A, Ekere NN. 2009. Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives Sadhana - Academy Proceedings in Engineering Sciences, 34 :799-810 DOI

Mallik S, Ekere NN, Durairaj R, Marks AE, Seman A. 2009. Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications Materials and Design, 30 :4502-4506 DOI

Durairaj R, Ramesh S, Mallik S, Seman A, Ekere N. 2009. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes Materials and Design, 30 :3812-3818 DOI

Durairaj R, Mallik S, Seman A, Marks A, Ekere NN. 2009. Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly Journal of Materials Processing Technology, 209 :3923-3930 DOI

Durairaj R, Mallik S, Ekere NN. 2008. Solder paste characterisation: Towards the development of quality control (QC) tool Soldering and Surface Mount Technology, 20 :34-40 DOI

Mallik S, Ekere NN, Marks AE, Durairaj R. 2008. An investigation into the rheological properties of different lead-free solder pastes for surface mount applications Soldering & Surface Mount Technology, 20 :3-10 DOI

Hillman SR, Mannan SH, Durairaj R, Seman A, Ekere NN, Dusek M, Hunt C. 2005. Correlation between jamming and skipping during solder paste printing Soldering and Surface Mount Technology, 17 :17-26 DOI

Jackson GJ, Hendriksen MW, Kay RW, Desmulliez M, Durairaj RK, Ekere NN. 2005. Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications Soldering and Surface Mount Technology, 17 :24-32 DOI

Durairaj R, Ekere NN, Salam B. 2004. Thixotropy flow behavior of solder and conductive adhesive pastes Journal of Materials Science: Materials in Electronics, 15 :677-683 DOI

He D, Ekere NN. 2004. Effect of particle size ratio on the conducting percolation threshold of granular conductive-insulating composites Journal of Physics D: Applied Physics, 37 :1848-1852 DOI

Salam B, Virseda C, Da H, Ekere NN, Durairaj R. 2004. Reflow profile study of the Sn-Ag-Cu solder Soldering and Surface Mount Technology, 16 DOI

He DA, Ekere NN, Salam B, Rajkumar D, Jackson . 2003. Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing Journal of Materials Science: Materials in Electronics, 14 :501-506 DOI

He D, Ekere NN, Cai L. 2002. Two-dimensional percolation and cluster structure of the random packing of binary disks Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics, 65 DOI Author Url

Durairaj R, Jackson GJ, Ekere NN, Glinski G, Bailey C. 2002. Correlation of solder paste rheology with computational simulations of the stencil printing process Soldering and Surface Mount Technology, 14 :11-17 DOI

Ekere NN, He D, Cai L. 2001. The influence of wall slip in the measurement of solder paste viscosity IEEE Transactions on Components and Packaging Technologies, 24 :468-473 DOI

Nguty TA, Salam B, Durairaj R, Ekere NN. 2001. Understanding the process window for printing lead-free solder pastes IEEE Transactions on Electronics Packaging Manufacturing, 24 :249-254 DOI

He D, Ekere NN. 2001. Viscosity of concentrated noncolloidal bidisperse suspensions Rheologica Acta, 40 :591-598 DOI

Durairaj R, Nguty TA, Ekere NN. 2001. Critical factors affecting paste flow during the stencil printing of solder paste Soldering and Surface Mount Technology, 13 :30-34 DOI

He D, Ekere NN. 2001. Structure simulation of concentrated suspensions of hard spherical particles AIChE Journal, 47 :53-59 DOI

He D, Ekere NN, Cai L. 2001. New statistic techniques for structure evaluation of particle packing Materials Science and Engineering A, 298 :209-215 DOI

Nguty TA, Ekere NN. 2000. Solder bumping Advanced Packaging, 9 :59-62

Nguty TA, Philpott JD, Ekere NN, Teckle S, Salam B, Rajkumar D. 2000. Rework techniques process evaluation for chip scale packages IEEE Transactions on Electronics Packaging Manufacturing, 23 :200-207 DOI

Nguty TA, Philpott D, Ekere NN, Salam B, Teckle S, Rajkumar D. 2000. Rework techniques process evaluation for chip scale packages IEEE Transactions on Electronics Packaging Manufacturing, 23 :155

Nguty TA, Ekere NN. 2000. Modeling the effects of temperature on the rheology of solder pastes and flux system Journal of Materials Science: Materials in Electronics, 11 :39-43 DOI

Nguty TA, Ekere NN. 2000. The rheological properties of solder and solar pastes and the effect on stencil printing Rheologica Acta, 39 :607-612 DOI

Nguty TA, Ekere NN. 2000. Monitoring the effects of storage on the rheological properties of solder paste Journal of Materials Science: Materials in Electronics, 11 :433-437 DOI

Nguty TA, Ekere NN, Philpott JD, Jones GD. 2000. Rework of CSP: The effect on surface intermetallic growth Soldering and Surface Mount Technology, 12 :35-38 DOI

Nguty TA, Salam B, Rajkumar D, Ekere NN. 2000. Understanding the process window for printing lead-free solder pastes Proceedings - Electronic Components and Technology Conference, :1426-1435

Nguty TA, Ekere NN. 1999. Modelling of flip chip assembly stand-off height American Society of Mechanical Engineers, EEP, 26 3 :55-63

Riedlin MHA, Ekere NM. 1999. How heat generation in stencil printing affects solder joint quality SMT Surface Mount Technology Magazine, 13 :74-80

Nguty TA, Ekere NN. 1999. Chip scale vs. flip chip: Issues to consider Circuits Assembly, 10 :27-32

Takyi G, Ekere NN, Snowdon KG, Tanner CG. 1999. Evaluation of plasma treated HASL finish PCBs using DCA measurements Journal of Electronics Manufacturing, 9 :233-239 DOI

Hendriksen MW, Frimpong FK, Ekere NN. 1999. Interconnect solutions for advanced area array packaging Microelectronics International, 16 :49-54 DOI

He D, Ekere NN, Cai L. 1999. Computer simulation of random packing of unequal particles Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics, 60 :7098-7104 DOI Author Url

Philpott JD, Tekle SM, Riedlin MHA, Ekere NN. 1999. Evaluation of CSP rework techniques National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), 1 :100-116

Nguty TA, Riedlin MHA, Ekere NN. 1999. Solder paste characterization for flip chip applications National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), 1 :589-601

Currie MA, Ekere NN. 1998. Stencil printing's aperture-emptying subprocess Circuits Assembly, 9 :40-51

Gieser H, Haunschild M. 1998. Very fast transmission line pulsing of integrated structures and the charged device model IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 21 :278-285 DOI

He D, Ekere NN. 1998. Computer simulation of powder compaction of spherical particles Journal of Materials Science Letters, 17 :1723-1725 DOI

He D, Ekere NN, Currie MA. 1998. Behavior of solder pastes in stencil printing with vibrating squeegee IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 21 :317-324 DOI

Riedlin MA, Ekere NN. 1997. Solder paste deposition for BGA rework Circuits Assembly, 8 :48-54

Horsley PM, Ekere NN. 1997. Causes of voiding in plastic ball grid array eutectic solder joints Soldering and Surface Mount Technology, 9 :18-22

Haslehurst L, Ekere NN. 1996. Parameter interactions in stencil printing of solder paste Journal of Electronics Manufacturing, 6 :307-316 DOI

Ekere NN, He D. 1996. The performance of vibrating squeegee in the stencil printing of solder pastes Journal of Electronics Manufacturing, 6 :261-270 DOI

Mannan SH, Ekere NN, Ismail I, Currie MA. 1995. Flow processes in solder paste during stencil printing for SMT assembly Journal of Materials Science: Materials in Electronics, 6 :34-42 DOI

Chan CY, Redford AH, Ekere NN. 1994. Cell controller software modelling for PCBA rework cell Soldering and Surface Mount Technology, :46-49

Chan CY, Redford AH, Ekere NN. 1994. Cell Controller Software Modelling for PCBA Rework Cell Soldering & Surface Mount Technology, 6 :46-49 DOI

Ekere NN, Lo EK, Mannan SH. 1994. Process Modelling Maps for Solder Paste Printing Soldering & Surface Mount Technology, 6 :4-11 DOI

Geren N, Ekere NN. 1994. Solder paste dispensing in robotic SMD rework Soldering and Surface Mount Technology, :21-25

Geren N, Ekere NN. 1994. Solder Paste Dispensing in Robotic SMD Rework Soldering & Surface Mount Technology, 6 :21-25 DOI

Mannan SH, Ekere NN, Ismail I, Lo EK. 1994. Squeegee Deformation Study In The Stencil Printing Of Solder Pastes IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 17 :470-476 DOI

Mannan SH, Ekere NN, Lo EK, Ismail I. 1993. Predicting scooping and skipping in solder paste printing for reflow soldering of SMT devices Soldering and Surface Mount Technology, :14-17

Mannan SH, Ekere NN, Lo EK, Ismail I. 1993. Predicting Scooping and Skipping in Solder Paste Printing for Reflow Soldering of SMT Devices Soldering & Surface Mount Technology, 5 :14-17 DOI

Lo EK, Ekere NN, Mannan SH, Ismail I. 1993. The Future of Solder Paste Printing for SMT Reflow Soldering Soldering & Surface Mount Technology, 5 :22-32 DOI

Ekere NN, Hannam RG. 1989. An evaluation of approaches to modelling and simulating manufacturing systems International Journal of Production Research, 27 :599-611 DOI

Conference publication

Njoku JE, Mallik S, Bhatti R, Amalu EH, Ekere NN. 2015. Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient Proceedings of the International Spring Seminar on Electronics Technology, 2015-September :231-236 DOI

Amalu EH, Ekere NN, Oduoza CF, Zarmai MT. 2015. Evaluation of garofalo creep model for lead-free solder joints in surface mount components NSTI: Advanced Materials - TechConnect Briefs 2015, 4 :282-285

Zarmai MT, Ekere NN, Oduoza CF, Amalu EH. 2015. Effect of intermetallic compound thickness on thermo-mechanical reliability of lead-free solder joints in solar cell assembly NSTI: Advanced Materials - TechConnect Briefs 2015, 4 :286-289

Ekpu M, Bhatti R, Ekere N, Mallik S, Otiaba K. 2012. Effects of thermal interface materials (solders) on thermal performance of a microelectronic package DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, :154-159

Otiaba KC, Bhatti RS, Ekere NN, Ekpu M, Adeyemi J. 2011. Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device 17th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2011, :115-119

Amalu EH, Ekere NN, Aminu G. 2011. Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings, :208-213 DOI

Ekpu M, Bhatti R, Ekere N, Mallik S, Amalu E, Otiaba K. 2011. Investigation of effects of heat sinks on thermal performance of microelectronic package 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings, :127-132 DOI

Otiaba KC, Bhatti RS, Ekere NN, Mallik S, Amalu EH, Ekpu M. 2011. Thermal effects of die-attach voids location and style on performance of chip level package 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings, :231-236 DOI

Ekpu M, Bhatti R, Ekere N, Mallik S. 2011. Advanced thermal management materials for heat sinks used in microelectronics EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings,

Amalu EH, Ekere NN, Aminu G. 2011. Modeling high temperature reliability of flip chip Pb-free solder joint at varying bond pad diameter AES-ATEMA International Conference Series - Advances and Trends in Engineering Materials and their Applications, :385-393

Otiaba KC, Ekere NN, Bhatti RS, Mallik S, Amalu EH. 2011. Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings,

Mallik S, Bauer R, Hübner F, Ekere NN. 2010. Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process AIP Conference Proceedings, 1315 :33-38 DOI

Amalu EH, Lui YT, Ekere NN, Bhatti RS, Takyi G. 2010. Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity AIP Conference Proceedings, 1315 :639-644 DOI

Bernasko PK, Mallik S, Ekere NN, Seman A, Takyi G. 2009. Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering Proceedings of the Electronic Packaging Technology Conference, EPTC, :986-990 DOI

Amalu EH, Ekere NN, Bhatti RS. 2009. High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology ICAST 2009 - 2nd International Conference on Adaptive Science and Technology, :146-153 DOI

Durairaj R, Man LW, Ramesh S, Wea LC, Leng EP, Ekere NN, Mallik S, Seman A. 2009. Investigation of wall-slip behavior in lead-free solder pastes and isotropic conductive adhesives Proceedings of the Electronic Packaging Technology Conference, EPTC, :422-426 DOI

Mallik S, Thieme J, Bauer R, Ekere NN, Seman A, Bhatti R, Durairaj R. 2009. Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance Proceedings of the Electronic Packaging Technology Conference, EPTC, :869-874 DOI

Seman A, Ekere NN, Ashenden SJ, Mallik S, Marks AE, Durairaj R. 2008. Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, :209-214 DOI

Wang W, Liu ZD, Tian ZJ, Huang YH, Liu ZX, Ekere NN. 2008. Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, :593-596 DOI

Marks AE, Mallik S, Ekere NN, Seman A. 2008. Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, :829-832 DOI

Mallik S, Schmidt M, Bauer R, Ekere NN. 2008. Influence of solder paste components on rheological behaviour Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, :1135-1140 DOI

Mallik S, Ekere NN, Marks AE, Seman A, Durairaj R. 2008. Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, :1219-1223 DOI

Durairaj R, Mallik S, Seman A, Marks A, Ekere NN. 2008. Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, DOI

Mallik S, Ekere NN, Durairaj R, Marks AE. 2007. A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :165-171 DOI

Marks AE, Mallik S, Ekere NN, Durairaj R. 2007. Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :14-19 DOI

Winter M, Durairaj R, Ekere NN, Bauer R. 2006. Rheological characterization of solder pastes with different procedures ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings, :511-516 DOI

Durairaj R, Mallik S, Marks A, Winter M, Bauer R, Ekere NN. 2006. Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2 :995-1000 DOI

Durairaj R, Seman A, Ekere NN. 2006. Development of Quality Control (QC) tools for solder pastes used for flip chip assembly based on oscillatory tests ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 1 :347-353 DOI

Saiam B, Ekere NN, Durairaj R. 2006. A study of Inter-Metallic Compounds (IMC) formation and growth in ultra-fine pitch Sn-Ag-Cu lead-free solder joints ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2 :988-994 DOI

Jackson GJ, Lu H, Durairaj R, Hoo N, Bailey C, Ekere NN, Wright J. 2004. Intermetallic phase detection in lead-free solders using synchrotron x-ray diffraction Journal of Electronic Materials, 33 :1524-1529 DOI

Jackson GJ, Hendriksen MW, Durairaj RK, Ekere NN, Desmulliez MPY, Kay RW. 2003. Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip Proceedings - Electronic Components and Technology Conference, :536-543

Jackson GJ, Hendriksen MW, Horsley R, Hoo N, Salam B, Ekere NN. 2003. Establishing control factors of intermetallic formation within Pb-free solder bumps at flip chip gometries Proceedings - Electronic Components and Technology Conference, :1472-1479

Jackson GJ, Hendriksen MW, Lu H, Ekere NN. 2002. Experimental and computational modelling characterisation of fine particle Pb-free solder paste volumes for flip chip assembly applications Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :304-309 DOI

Jackson GJ, Durairaj R, Ekere NN. 2002. Characterisation of lead-free solder pastes for low cost flip-chip bumping Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :223-228 DOI

Horsley RM, Ekere NN, Salam B. 2002. Effect of lead-free BGA rework on joint microstructure and intermetallic compound formation Proceedings - Electronic Components and Technology Conference, :1497-1501 DOI

Salam B, Ekere NN, Rajkumar D. 2001. Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation Proceedings - Electronic Components and Technology Conference, :471-477

Rajkumar D, Nguty T, Ekere NN. 2000. Optimising process parameters for flip chip stencil printing using Taguchi's method Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :382-388

He D, Ekere NN. 2000. Study of solder paste flow inside a sealed printing head Proceedings - Electronic Components and Technology Conference, :142-146

Nguty TA, Salam B, Ekere NN. 2000. Parametric study of the effects of process parameters on the assembly of chip scale packages Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, :208-210

Philpott JD, Nguty TA, Ekere NN, Jones GD. 1999. Effect of CSP rework on surface intermetallic growth Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :141-147

Nguty TA, Ekere NN, Adebayo A. 1999. Correlating solder paste composition with stencil printing performance Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :304-312

Nguty TA, Ekere NN. 1999. Modelling of flip chip assembly stand-off height American Society of Mechanical Engineers, EEP, 26

Ekere NN, Lawson W. 1999. Use of the Area-Of-Spread method for monitoring the stability of reflow furnaces Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :115-119

Ekere NN, He D, Riedlin MHA. 1998. The viscoelastic characteristics of solder paste under high frequency oscillatory shear Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :373-376 DOI

Nguty TA, Riedlin MHA, Ekere NN. 1998. Evaluation of process parameters for flip chip stencil printing Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :206-216 DOI

Takyi G, Ekere NN, Philpott JD, Snowdon KG, Tanner CG. 1998. Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :172-186 DOI

He D, Ekere NN, Currie MA. 1997. Study of the response of solder pastes under sinusoidal vibration Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :37-43

Riedlin MHA, Ekere NN. 1997. Rheological techniques for measuring normal stress differences of solder pastes Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, :178-183

Ekere NN, Mannan SH, Currie MA. 1995. Solder paste printing process modelling map Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium, :137-141

Currie MA, Ekere NN, Mannan SH, Ismail I. 1994. Solder paste characteristics and their effect on fine pitch printing IEE Conference Publication, :552-558 DOI

Chapters

Mallik S, Ekere N. 2013. Metal matrix composites as thermal management materials for automotive applications Engineered Metal Matrix Composites: Forming Methods, Material Properties and Industrial Applications :113-126 9781620817193

Ekere NN, Hannam RG. 1991. Modeling and simulation of manufacturing systems Control and Dynamic Systems 49 :129-190 DOI

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